Journal of Pattern Recognition Research

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z All

R

Reforgiato Recupero Diego, University of Catania
Rege Priti P., COEP
Ross Jeremy D., Bowling Green State University
Roy Kaushik, West Bengal State University

S

SARVAIYA JIGNESH NATVARLAL, SVNIT, ELECTRONICS ENGG. DEPT. SURAT
Sabourin Robert, Ecole de technologie superieure
Sahba Farhang, University of Waterloo
Sajo Levente
Sakla Wesam, U.S. Air Force Research Laboratory
Sanniti di Baja Gabriella, Institute of Cybernetics
Schuster Maria
Sengupta Sunando, INDIAN INSTITUTE OF TECHNOLOGY
Sepp Tapio, University of Oulu
Shahrour Isam
Sharma Alok, University of Tokyo
Sharma Paawan, University of Petroleum & Energy Studies, Dehradun, INDIA
Shelke Sushama Deepak, Pune Institute of Computer Technology
Sid-Ahmed Maher A, Electrical and Computer Engineering, University of Windsor
Simske Steven, Hewlett-Packard
Simske Steven J., Hewlett-Packard
Singh Abhishek, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL
Singh Brijmohan, Astt. Professor, Deptt. of CSE, College of Engineering Roorkee, Roorkee-247667 (INDIA)
Sk Obaidullah Md, Aliah University
Soinov Lev, Geneservice Ltd
Soloviev A. A., International Institute of Earthquake Prediction Theory and Mathematical Geophysics, Russian Academy of Sciences
Son Seung Woo, Northwestern University
Steidl Stefan
Stranieri Andrew, University of Ballarat, Ballarat 3353 Australia
Sumetphong Chaivatna, Mahidol University
Sun Guobing, University of Oulu

T

Tan Jinglu, University of Missouri
Tanaka Hiroshi, Japan Advanced Institute of Science and Technology
Tangwongsan Supachai, Mahidol University
Tappert Charles, Pace University
Tappert Charles C, Pace University
Terada Kenji, The University of Tokushima
Tizhoosh Hamid R., University of Waterloo
Toet Alexander, TNO
Tsoukalas Lefteri H., Purdue University

U

Urolagin Siddhaling, Manipal Institute of Technology
Usynin Aleksander, The University of Tennessee
Uvet Huseyin, Nagoya University

V

Vakhutinsky Andrew, Oracle Labs, Burlington, MA
Valdez-Cepeda Ricardo David, Universidad Autonoma Chapingo
Van Droogenbroeck Marc, INTELSIG Laboratory, Montefiore Institute, University of Liège
Vasikarla Shantaram, California State University
Velasco Francisco
Volkovich Zeev
Volkovich Zeev, Braude College
Vural Sadi, Osaka University

W

Waksman Peter, Dentsply International
Wang Piyang, City University of Hong Kong
Wang Qiong, Nanjing University of Science & Technology
Wang YuanBin, Institute of Computer Application Technology, Northeastern University
Wenhardt Stefan
Winberg F. E., International Institute of Earthquake Prediction Theory and Mathematical Geophysics, Russian Academy of Sciences
Woodard Damon, Clemson University
Woodard Damon, University of Florida
Wu Su-Ming, Oracle Retail Science Group, Burlington, MA
Wu Tirui, Ford Motor Research & Engineering (Nanjing) Co., Ltd
Wu Tirui, Sanghua Microelectronics (Shanghai) Co, Ltd., Shanghai

X

Xie Liangjun, Schlumberger Limited

Y

Yadava R. D. S., Department of Physics, Faculty of Science, Banaras Hindu University, India-221005
Yan Sheng, EE Department, Pohang University of Science and Technology
Yan Sheng, POSTECH
Yang Hongwei, The University of Kentucky
Yang Jingyu, Nanjing University of Science & Technology
Yang Mingqiang, ISPCV, Shandong University
Yatsko Andrew, University of Ballarat, Ballarat 3353 Australia
Ye Liang, Harbin Institute of Technology
Ye Liang, University of Oulu
Yin Junsong, National University of Defense Technology, China
Yoon Sungsoo, Ewha Womans University
Yu Jinhua, University of Missouri

Z

Zaveri Mukesh A., Sardar Vallabhbhai National Institute of Technology
Zaveri Tanish Hemalbhai, Nirma University
Zervakis Michalis, Technical University of Crete
Zhang Zhu, University of Oulu
Zhao Chun-xia, Nanjing University of Science & Technology
Zhou Z., College of Mechatronics and Automation, National University of Defense Technology, China